HDI
High Density Interconnect — microvias and vias-in-pad for boards under 50×50 mm with BGA
We design anything from simple 2-layer boards to 60-layer HDI with laser microvias. We validate manufacturability before you pay for fabrication.
The classic problem: the circuit designer gets the customer BOM, creates an ideal topology, then procurement finds half the chips are on 26–40 week lead times. Re-layout = 2–4 weeks + validation + money. Our circuit designer sits in the same office as the component sourcing manager.
We gather requirements: dimensions, interfaces, temperature range, EMC requirements. We create a block diagram and preliminary complexity estimate. Deliverable: signed specification with fixed cost and schedule.
Schematic design, power rail analysis, and component selection with availability in mind. We check every part against current stock.
Component placement, routing, and characteristic-impedance control for high-speed lines (USB 3.0, HDMI, Gigabit Ethernet). Signal-integrity simulation when required.
We check minimum clearances, trace widths, hole ratios, and thermal zones. We generate Gerber, production order, and Pick&Place data, then submit the package for factory review before launch.
Fabrication of 2–5 samples. We check net integrity, solder joint quality, and dimensional compliance. Functional testing when firmware is available.
Full package: Gerber, assembly drawing, BOM, soldering and test instructions. We support the first production run and clear early issues.
High Density Interconnect — microvias and vias-in-pad for boards under 50×50 mm with BGA
Precise characteristic-impedance matching for USB 3.0, HDMI, Ethernet, DDR
Design for Manufacturing — manufacturability review before production release
Combination of rigid and flexible sections for foldable designs and medtech
Aluminum substrate for heat dissipation — LED drivers, power electronics
Send your requirements, schematic, or even a paper sketch. We’ll tell you complexity, lead time, and cost.
