A reference guide to electronics terms for engineers, buyers, and managers.
- BOM (Bill of Materials)
- Bill of Materials — a complete list of components required to manufacture a printed circuit board or device.
- PCB (Printed Circuit Board)
- Printed Circuit Board — a dielectric substrate with conductive traces that interconnect electronic components.
- HDI (High Density Interconnect)
- High Density Interconnect — a multilayer board technology employing microvias for compact electronic devices.
- DFM (Design for Manufacturing)
- Design for Manufacturing — a design analysis process carried out before volume production begins.
- FPGA
- Field-Programmable Gate Array — an integrated circuit whose configuration is defined after manufacturing.
- Import Substitution
- Replacement of foreign components and technologies with domestic equivalents while preserving functionality.
- BGA (Ball Grid Array)
- Ball Grid Array — an integrated circuit package with solder-ball contacts arranged on the underside.
- RoHS
- Restriction of Hazardous Substances — a directive that restricts lead, mercury, cadmium, and other hazardous substances in electronic products.
